Performance of Laser Powder Bed Fusion (LPBF)-based coolers for semi-conductive thermoelectric modules

The performance and longevity of semi-conductive thermoelectric modules depend heavily on efficient thermal management, which is essential across applications in electronics, battery systems, and biomedical technologies. Conventional manufacturing approaches for compact cooling structures are limited by geometric complexity, machining difficulties, and high prototyping costs. In this study, Laser Powder Bed Fusion (LPBF)-based additively manufactured passive AlSi10Mg coolers were designed, fabricated, and thermally evaluated. Three distinct geometries with equal fill ratios were designed to optimize heat dissipation across thermoelectric module surfaces. Numerical simulations verified thermal distribution prior to fabrication, ensuring alignment between design parameters and module requirements. The LPBF-based additive manufacturing enabled the precise realization of complex geometries, producing components with high dimensional accuracy, excellent surface quality, and thermal conductivity suitable for integration with TEC-12710 modules. Following fabrication, the cooling structures were mounted to the thermoelectric modules with thermal paste and tested under controlled conditions. Results confirmed that LPBF-fabricated geometries enhanced heat transfer efficiency, accelerated surface cooling, and provided more uniform temperature distribution compared to conventional designs. The findings demonstrate the potential of LPBF as a versatile and cost-effective solution for manufacturing tailored thermal management coolers for thermoelectric components, with promising applications in mechatronic devices, medical electronics, energy storage, and compact thermal regulation systems.